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High Density Interconnect

Product ID:SN20210628215920270
Description

Layer count:6L 2+N+2  High density interconnection ‘HDI’

Materials : High TG180 

Finished Board thickness:1.6mm

Min. hole size :Laser drill hole 0.1mm

Min. trace width / spacing:0.075mm/0.07 5mm 

Surface treatment :Immersion Gold 2”

Product features : Laser drill holes,Impedance control, BGA size 0.25mm 

Applications :Data communication modules