You Location:Home » Products » Blind Vias Holes(BVH) » Blind Vias Holes + High Density Interconnect

Blind Vias Holes + High Density Interconnect

Product ID:SN20210613183013833
Description

Layer count 6L BVH + High Density Interconnect  ‘HDI’

Materials High TG170

Finished Board thickness1.0mm

Min hole size0.1mm

Min trace width / spacing0.075mm/0.07 5mm

Surface treatmentImmersion gold 2’

Product feature : Laser drill holes 4 mil + BVHImpedance control, BGA size 0.25mm

ApplicationBluetooth 5.1 True Wireless, ANC, Headphone