You Location:Home » Products » High Density Interconnect » High Density Interconnect

High Density Interconnect

Product ID:SN20210524223204568
Description

Layer count 4L High Density Interconnect  ‘HDI’

Materials High TG180

Finished Board thickness1.0mm

Min hole size0.1mm

Min trace width / spacing0.075mm/0.07 5mm

Surface treatmentImmersion gold 2"

Product feature : Laser drill holes 4 milImpedance controledge platingedge holes plating, BGA size 0.25mm

ApplicationData communication modules