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High Density Interconnect

Product ID:SN20210524222719612
Description

Layer count4L High Density Interconnect ‘HDI’

Materials : High TG180

Finished Board thickness1.0mm

Min. hole size Laser drill hole 0.1mm

Min. trace width / spacing0.075mm/0.07 5mm

Surface treatment Immersion gold 2"

Product features : Laser drill holesImpedance control, edge plating, edge holes plating, BGA size 0.25mm

Applications Data communication modules